I have a plastic encapsulated ASIC device, but it is in the wrong pin-out configuration, can you reconfigure the pin-out?
Yes

I cannot obtain certain die for my hybrids because the distributors either do not have it or require a minimum purchase, can you help?
Yes, if the die exists in a plastic package, we can remove it for you and you can then remount it into your hybrids or MCM's. We can also remove die from many ceramic packages also.

Can you remove die from SOIC's, SOT's, plastic BGA's, micro BGA's, etc.?
Yes, almost any device encapsulated in plastic and some devices in ceramic packages also.

Will the die surface and bondpads look corroded after decapsulation?
No, they will look brand new. We have a patent pending status on this method of removal and cleaning process.

Will the back of the die have residue which can affect rebondability?
No, the back of the die will be clean like new on devices removed from plastic packages.

Will you take orders for only 1 or 2 devices? What is the minimum quantity?
Absolutely!! That is the beauty of this process. Many customers only need 1 or 2 parts to replace a defective one. The minimum quantity is 1 device.

Can you supply KGD (known good die)?
yes, we can burn-in and screen devices before removing them from the plastic packages first. Then remove only the ones which passed all of the burn-in and electrical temperature testing.

Will your decapsulation process ruin the metallization pad so that I cannot get a good bond when I rebond it into my hybrid?
No, it will not affect the metallization pad because we detach the wire at the neckdown, leaving the old ball-bond intact. We then reshape the old ball-bond and flatten them into brand new bonding pads where you can bond to. See the photo at the top.