DPEM / DCEM
Decapsulation of Plastic Encapsulated Modules (PEM), removal of die and repackage removed die into ceramic package or hybrid. This is a solution for obtaining obsolete or hard-to-find IC's which are no longer manufactured in required pin-outs or hermetic packages. These parts can save millions of dollars when replacement parts are needed for boards or assemblies. Instead of redesigning an entire board or refoundry of chip, just substitute it with a DPEM. The DPEM can be screened to MIL-STD-883 class B or Class S procedures. This process can also be used to decapsulate plastic IC's for failure analysis work. We can selectively etch and remove the top portion of the plastic IC, leaving all bondwires intact and exposing the die for failure analysis.
We can also remove die from ceramic packages (DCEM).

Custom Packaging
Custom Packaging of IC's, Hybrids, MCM's. Custom Packaging of reclaimed IC chips for Radiation Hardness Testing or Die-Qual.

Screening & Testing
Screening & Testing of electronic components such as IC's, Transistors, Diodes per MIL-STD-883 & 750.

Failure Analysis
Failure Analysis of microelectronic components to reveal failure mechanism.

Parts Management
Purchasing and screening of compoents for your entire system.

Upscreening of COTS & PEMS
Upscreening of COTS and PEMS for Military and Space Environments.

Environmental Testing
Full environmental testing of electronic components per MIL-STD-883, MIL-STD-750, MIL-STD-202 such as temp cycling, temp shock, vibration, humidity, salt & fog, high temp burn-in, etc.

HAST Testing
Highly Accelerated Stress & Temperature Testing to evaluate moisture absorption and moisture resistance properties of components

Scanning Electron Microscope, SEM/EDXA
Scanning Electron Microscope, SEM/EDXA Services. Non-biological samples only.

X-Ray Radiography
X-Ray Radiography services of electronic components