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Obsolete Die And Integrated Circuit Replacement: Obsolete Component Solutions.
Obsolete die and IC ( integrated circuit ) replacement and more: obsolete component solutions. We have developed a process to remove die from plastic encapsulated modules and repackage them. |  | DPA Components InternationalTotal solutions to obsolete die and IC replacement
DPA Components provides the world with transistors, diodes and IC's for Space and Military applications. We have developed an exclusive patented process to remove die from plastic encapsulated modules (PEM) and repackage them into ceramic hi-rel packages. The product is called "DPEM" and can satisfy form-fit-function requirements of spare parts replacement of military and space components. We can also remove die from some ceramic packages, referred to as "DCEM". The removed die can also be used for your hybrids, MCM's or radiation hardness testing needs.
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DPEM / DCEM - Process Flow:
- Pre-electrical test (-55C, +25C, +125C)
- Die removal from original plastic /ceramic package
- Tamping new gold bondpads over old aluminum bondpads
- Die attach into new ceramic / plastic package
- Gold wire bonding
- Internal visual Inspection
- Package sealing
- Post-electrical test (-55C, +25C, +125C)
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Call now to see if we can offer a solution to your obsolete component needs !! Obsolete die and IC ( integrated circuit ) replacement and more: obsolete component solutions. We have developed a process to remove die from plastic encapsulated modules and repackage them. | |
Click here to visit DPA Components International page
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DPA Components International
2251 Ward Avenue
Simi Valley,
CA 93065
Phone: 805-581-9200
Fax: 805-581-9790
E-mail: info@dpems.com
Visitor since 11/03/1999
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